Artiza LTE eNB/EPC Test Solutions

UE-SIM PHY Features

The outstanding testing capacity of 840UEs/sector is the first in the industry, made possible by high-performance baseband processing units with a number of FPGAs/DSPs connected by a 10 Gbps sRIO interface on one blade. This original blade (Figure 1) is entirely developed by Artiza’s in-house engineering team from the PCB (20Kpins) design to FPGA logical circuit and DSP software implementation, well crafted to the level of artistic work. With the special blade hardware design, the LTE eNB Tester product has the full control of baseband processing (Table 1), especially for PHY/MAC layers testing, which is one of the most important factors for LTE eNB performance. Product architecture is also flexible for load level (XD/HD/FD) by the number of DSP modules installed in a platform depending on user needs (Figure 2).

Figure 1: Baseband Blade (AN2-B-BB-02)

Figure 1: Baseband Blade (AN2-B-BB-02)

Figure 2: AZP-1400/500

Figure: AZP-500 AZP-1400

Table 1: UE-SIM PHY Specification
Parameter Specification
DL/UL Duplex Mode FDD/TDD Software Selectable
Baseband Implementation FPGAs/DSPs (without ASSPs)
Frequency Operation bands (FDD:1-14,17/TDD:33-40)
System Bandwidth (DL/UL) 1.4/3/5/10/15/20 MHz
Modulation (DL/UL) QPSK/16QAM/64QAM (dynamically configurable)
Multiple Access DL OFDMA
UL SC-FDMA (DFT-Spread OFDM)
Antenna DL Up to 2 x 2
UL 1 x 1
Interface Analog IQ/RF (with RFunit)/CPRI (OBSAI in roadmap)
Physical Channels DL Synchronization Signal/Reference Signal/
PBCH/PCFICH/PHICH/PDCCH/PDSCH
UL Reference Signal(Demodulation)/ReferenceSignal(Sounding)/
PRACH/PUCCH/PUSCH