Chassis
Figure 1: AZP-1400 Chassis
Table 1: AZP-1400 Chassis Specification
| AZP-1400 | Description | |
|---|---|---|
| Fuse | 30 A (16 fuses in total) | |
| Input power | 25 A x 4 lines x 2 systems (Note) | |
| Input voltage | -40.5 VDC to -72 VDC | |
| Operating environment | Temperature | 10°C to 40°C |
| Humidity | 30 to 80% (non-condensing) | |
| Dimensions | 572 mm(H) x 483 mm(W) x 507 mm(D) | |
| Weight | Approximately 30.6 kg | |
| Power consumption | 350 W | |
| Conforming standard | RoHS | |
| Withstand voltage | EN 60950 compliant 1,000 V | |
| 
Figure 2: AZP-600 Chassis
Table 2: AZP-600 Chassis Specification
| AZP-600 | Description | |
|---|---|---|
| Input power | 30 A x 2 lines | |
| Input voltage | 40.5 VDC to -72 VDC | |
| Operating environment | Temperature | 5°C to 40°C |
| Humidity | 5 to 85% (non-condensing) | |
| Dimensions | 220 mm(H) x 483 mm(W) x 464 mm(D) | |
| Weight | Approximately 15 kg | |
| Power consumption | 308 W | |
| Conforming standard | RoHS | |
| Withstand voltage | EN 60950 compliant 1,000 V | |
Figure 3: AZP-500 Chassis
Table 3: AZP-500 Chassis Specification (UE-SIM)
| AZP-500 | Description | |
|---|---|---|
| Input power | 30 A x 2 lines | |
| Input voltage | -40.5 VDC to -72 VDC | |
| Operating environment | Temperature | 10°C to 40°C |
| Humidity | 30 to 80% (non-condensing) | |
| Dimensions | 222 mm(H) x 480 mm(W) x 415 mm(D) | |
| Weight | Approximately 15 kg | |
| Power consumption | 308 W | |
| Conforming standard | RoHS | |
| Withstand voltage | EN 60950 compliant 1,000 V | |
Figure 4: ANPro-800 Chassis
Table 4: ANPro-800 Chassis Specification (S1/X2-SIM)
| Parameter | Description | |
|---|---|---|
| Base Design | Compact-PCI (8 slots) with proprietary backplane | |
| Physical Dimensions | 463 mm (W) x 237 mm (H) x 602 mm (D) | |
| Weight | 15 kg (not including modules) | |
| Power | 100 VAC – 240 VAC | |
| Environmental | Ambient temperature | +10 C to +40 C |
| Humidity | +30 % to +80 %, no condensation | |
Figure 5: LTE-XEST-1
Figure 6: LTE-XEST-1 Inside
Figure 7: LED side of chassis
Figure 8: Connector side of chassis
Table 5: LTE-XEST-1 Specifications
| Parameter | Description |
|---|---|
| Test Port | SFP (ETHER-0) |
| Control Ports | RJ-45 (ETHER-1) |
| RJ-45 (RS-232C) | |
| VLAN | IEEE802.1Q |
| Shaper Algorithm | Leaky Bucket (per user) (IFG: 96 bits / preamble: 7 Bytes / SFD: 1 Byte is included) |
| Generation Rate | 1 kbps - 1,000 Mbps / 1 kbps resolution |
| Frame Size | 64 bytes - 16,000 bytes (fixed or user defined sequence) |
| Data | User Definable |
| Frequency Accuracy | ±25 ppm |
| Jitter | ±1 μsec |
| MTBF | 200,000 hours |
| Operating Temperature/Humidity | 0 to 35°C / 30 to 75 % |
| Storage Temperature/Humidity | -20 to 60 °C / 20 to 90 % |
| Dimensions | 130 mm (W) × 44 mm (H) × 192 mm (D) |
| Weight | 550 g (AC Adaptor not included) |
| Power | AC Adaptor |
Table 6: Test Port (ETHER-0) Specifications
| Parameter | Description | |
|---|---|---|
| Connector | SFP+ MSA | |
| Interfaces | 10GBASE-SR (Full Duplex) | |
| 10GBASE-LR (Full Duplex) | ||
| 10GBASE-ER (Full Duplex) (in roadmap) | ||
| 1000BASE-SX (Full Duplex) | ||
| 1000BASE-LX (Full Duplex) | ||
| 100BASE-TX (Full Duplex/Half Duplex) | ||
| 10BASE-T (Full Duplex/Half Duplex) | ||
| MDI / MDI-X | Auto MDI / MDIX (only for 1000BASE-T, 100BASE-TX, 10BAST-T) |
|
| SFP+ Interfaces | AFBR-703SDZ | 10GBASE-SR |
| AFBR-703ASDZ | ||
| AFCT-701SDZ | 10GBASE-LR | |
| AFCT-701ASDZ | ||
| TBD | 10GBASE-ER | |
| SFP Interfaces | SFP-850-03 | 1000BASE-SX |
| SFP-1310-01 | 1000BASE-LX | |
| SFP-1310-02 | ||
| SFP-RJ45-02 | 10BASE-T | |
| 100BASE-TX | ||
| 1000BASE-T | ||
Table 7: AFBR-703SDZ/AFBR-703ASDZ Specifications
| Parameter | Description |
|---|---|
| Interfaces | 10GBASE-SR |
| Connector | LC multi-mode (MMF) |
| Optical Output Power, Average | -4.3[OMA] to -1[mean] dBm |
| Spectral Center Wavelength | 840 to 860 nm |
| Min. Receiver Sensitivity | -11.1[OMA] to -1[Pave] dBm |
| Spectral Center Wavelength | 840 to 860 nm |
| RX_LOS De-assert Level | -30[OMA] to -12[OMA] dBm |
Table 8: AFCT-701SDZ/AFCT-701ASDZ Specifications
| Parameter | Description |
|---|---|
| Interfaces | 10GBASE-LR |
| Connector | LC single-mode (SMF) |
| Optical Output Power, Average | -8.2[mean] to 0.5[mean] dBm |
| Spectral Center Wavelength | 1,260 to 1,355 nm |
| Min. Receiver Sensitivity | -10.3[OMA] to 0.5[mean] dBm |
| Spectral Center Wavelength | 1,260 to 1,355 nm |
| RX_LOS De-assert Level | -30[OMA] to -17[OMA] dBm |
Table 9: SFP-850-03 Specifications
| Parameter | Description |
|---|---|
| Interfaces | 1000BASE-SX |
| Connector | LC multi-mode (MMF) |
| Optical Output Power, Average | -9.5 to -4 dBm |
| Spectral Center Wavelength | 830 to 860 nm |
| Min. Receiver Sensitivity @BER= 1×10-12 |
-17 to 0 dBm |
| Spectral Center Wavelength | 770 to 870 nm |
| RX_LOS De-assert Level | -31 to -19 dBm |
Table 10: SFP-1310-01/SFP-1310-02 Specifications
| Parameter | Description |
|---|---|
| Interfaces | 1000BASE-LX |
| Connector | LC single-mode (SMF) |
| LC multi-mode (MMF) | |
| Optical Output Power, Average | -9.5 to -3 dBm (SMF) |
| -11.5 to -3 dBm (MMF) | |
| Spectral Center Wavelength | 1,280 to 1,345 nm |
| Min. Receiver Sensitivity @BER= 1×10-12 |
-20.5 to -3 dBm |
| Spectral Center Wavelength | 1,270 to 1,355 nm |
| RX_LOS De-assert Level | -29.5 to -20.5 dBm |
Table 11: SFP-RJ45-02 Specifications
| Parameter | Description |
|---|---|
| Interfaces | 1000BASE-T / 100BASE-TX / 10BASE-T |
| Connector | RJ45 |
| MDI / MDIX | Auto MDI / MDIX |
Table 12: ETHER-1 Port Specifications
| Parameter | Description |
|---|---|
| Connector | Modular Jack Connector (RJ45) |
| Interfaces | 100BASE-TX (Full Duplex / Half Duplex) |
| 10BASE-T (Full Duplex / Half Duplex) | |
| MDI / MDIX | Auto MDI / MDIX |
Figure 8: FURA Chassis (GSP800-2)
Table 12: ETHER-1 Port Specifications
| Parameter | Description |
|---|---|
| Base Design | Industrial Windows PC |
| Physical Dimensions | 411 mm (W) x 305 mm (H) x 226 mm (D) |
| Weight | 12 kg |
| Power | 100 VAC – 240 VAC |
| CPU | Intel Core 2 Duo 2.6G |
| Memory | 4 GByte DDR2 OCC |
| HDD | 640 GByte |